Microsoft has introduced a new microfluidic cooling system that could transform data center efficiency and sustainability. The technology cools AI chips up to three times more effectively than today’s advanced cold plate systems, a key development as next-generation GPUs generate unprecedented levels of heat.
Cooling at the Silicon Level
The innovation etches tiny microchannels—similar in size to a human hair—directly into the back of a silicon chip. Liquid coolant flows through these channels, pulling heat away at the source rather than through several insulating layers.
Microsoft researchers also used AI to analyze unique thermal patterns across the chip and optimize coolant flow, improving performance and reducing maximum temperature rise by up to 65%.
“Microfluidics would allow for more power-dense designs that will enable more features that customers care about and give better performance in a smaller amount of space,” said Judy Priest, corporate vice president and CTO of Cloud Operations and Innovation at Microsoft.
Benefits for Datacenter Efficiency
Current cooling approaches rely on air or cold plates, which limit how tightly servers can be packed together. By cooling chips directly, microfluidics could allow Microsoft to increase server density, reduce energy used for chilling coolant, and lower datacenter operational costs. The technique also enables safe overclocking—pushing servers harder during peak workloads—without damaging chips.
“If you’re still relying heavily on traditional cold plate technology, you’re stuck,” said Sashi Majety, senior technical program manager for Microsoft’s Cloud Operations and Innovation group.
Bio-Inspired Design and AI Optimization
To perfect the system, Microsoft collaborated with Swiss startup Corintis and used AI to create bio-inspired channel designs modeled after the branching patterns in leaves and butterfly wings. These optimized layouts distribute coolant more efficiently than straight channels and minimize the risk of clogging while maintaining chip strength.
Preparing for the Future of AI Workloads
The breakthrough comes as Microsoft invests over $30 billion in infrastructure this quarter, including the development of its Cobalt and Maia chips. Microfluidics may play a role in future chip generations, including 3D-stacked architectures that would otherwise overheat under traditional cooling methods.
“Microfluidics improves cost, reliability, speed, consistency of behavior, and sustainability,” said Jim Kleewein, Microsoft technical fellow for Microsoft 365 Core Management. “We want microfluidics to become something everybody does.”
If widely adopted, microfluidic cooling could reshape datacenter design, allowing more compute power in less space and supporting the growing demand for AI services.
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Cooling at the Silicon Level
The innovation etches tiny microchannels—similar in size to a human hair—directly into the back of a silicon chip. Liquid coolant flows through these channels, pulling heat away at the source rather than through several insulating layers.
Microsoft researchers also used AI to analyze unique thermal patterns across the chip and optimize coolant flow, improving performance and reducing maximum temperature rise by up to 65%.
“Microfluidics would allow for more power-dense designs that will enable more features that customers care about and give better performance in a smaller amount of space,” said Judy Priest, corporate vice president and CTO of Cloud Operations and Innovation at Microsoft.
Benefits for Datacenter Efficiency
Current cooling approaches rely on air or cold plates, which limit how tightly servers can be packed together. By cooling chips directly, microfluidics could allow Microsoft to increase server density, reduce energy used for chilling coolant, and lower datacenter operational costs. The technique also enables safe overclocking—pushing servers harder during peak workloads—without damaging chips.
“If you’re still relying heavily on traditional cold plate technology, you’re stuck,” said Sashi Majety, senior technical program manager for Microsoft’s Cloud Operations and Innovation group.
Bio-Inspired Design and AI Optimization
To perfect the system, Microsoft collaborated with Swiss startup Corintis and used AI to create bio-inspired channel designs modeled after the branching patterns in leaves and butterfly wings. These optimized layouts distribute coolant more efficiently than straight channels and minimize the risk of clogging while maintaining chip strength.
Preparing for the Future of AI Workloads
The breakthrough comes as Microsoft invests over $30 billion in infrastructure this quarter, including the development of its Cobalt and Maia chips. Microfluidics may play a role in future chip generations, including 3D-stacked architectures that would otherwise overheat under traditional cooling methods.
“Microfluidics improves cost, reliability, speed, consistency of behavior, and sustainability,” said Jim Kleewein, Microsoft technical fellow for Microsoft 365 Core Management. “We want microfluidics to become something everybody does.”
If widely adopted, microfluidic cooling could reshape datacenter design, allowing more compute power in less space and supporting the growing demand for AI services.
Join thousands of practitioners at ODSC AI West 2025, the leading applied data science conference. Gain hands-on training in generative AI, LLMs, RAG, AI Safety, and more through expert-led workshops and bootcamps. Explore cutting-edge tools in the AI Expo Hall, connect with industry leaders, and customize your experience with flexible 1- to 4-day passes. Don’t miss this chance to expand your AI skills and network—register now to secure your spot.
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